Zacks Rating on KLA-Tencor Corporation (KLAC)

KLA-Tencor Corporation (KLAC) : 1 brokerage houses believe that KLA-Tencor Corporation (KLAC) is a Strong Buy at current levels. 5 analysts believe that the current prices are in a balance with the stocks fundamentals, hence they propose Hold on KLA-Tencor Corporation (KLAC). Zacks Investment Research suggests a Hold with a rank of 3.The median of all the 6 Wall Street Analysts endorse the stock as a Hold with a rating of 2.67.

KLA-Tencor Corporation (KLAC) stock is expected to deviate a maximum of $9.2 from the average target price of $71.8 for the short term period. 5 Street Experts have initiated coverage on the stock with the most promising target being $79 and the most muted being $59.


KLA-Tencor Corporation has lost 1.65% in the last five trading days and dropped 10.36% in the last 4 weeks. KLA-Tencor Corporation has dropped 3.42% during the last 3-month period . Year-to-Date the stock performance stands at 0.42%. KLA-Tencor Corporation (NASDAQ:KLAC): On Tuesdays trading session , Opening price of the stock was $70.76 with an intraday high of $71.135. The bears continued to sell at higher levels and eventually sold the stock down to an intraday low of $67.71. However, the stock managed to close at $68.05, a loss of 3.50% for the day. On the previous day, the stock had closed at $70.52. The total traded volume of the day was 2,441,822 shares.

KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.

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