Analyst Price Target Update on Lam Research Corporation (NASDAQ:LRCX)

Lam Research Corporation (NASDAQ:LRCX): 9 analysts have set the short term price target of Lam Research Corporation (NASDAQ:LRCX) at $93.78. The standard deviation of short term price target has been estimated at $4.58, implying that the actual price may fluctuate by this value. The higher and the lower price estimates are $ 100 and $85 respectively.

Many analysts have stated their opinion on the company shares. RBC Capital initiates coverage on Lam Research Corporation (NASDAQ:LRCX). RBC Capital has a Outperform rating on the shares. As per the latest report, the brokerage house announces the price target to $92 per share. The rating by the firm was issued on March 16, 2016. For the current week, the company shares have a recommendation consensus of Buy.

On the companys insider trading activities, Anstice Martin B, officer (President and CEO) of Lam Research Corp, unloaded 7,948 shares at an average price of $73.9 on October 26, 2015. The total amount of the transaction was worth $587,357, according to the disclosed information with the Securities and Exchange Commission in a Form 4 filing.

Lam Research Corporation (NASDAQ:LRCX) stock ended Monday session in the red zone in a volatile trading. The stock closed down 0.39 points or 0.47% at $81.98 with 1,418,960 shares getting traded. Post opening the session at $81.5456, the shares hit an intraday low of $81.2 and an intraday high of $82.85 and the price was in this range throughout the day. The company has a market cap of $13,084 million and the number of outstanding shares have been calculated to be 159,597,650 shares. The 52-week high of Lam Research Corporation (NASDAQ:LRCX) is $84.39 and the 52-week low is $61.2.

Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.

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