KLA-Tencor Corporation (KLAC) : 6 analysts are covering KLA-Tencor Corporation (KLAC) and their average rating on the stock is 2.67, which is read as a Hold. 1 equity analysts believe that the stock has a bright future and the price doesnt capture all of its upside, hence they rate the stock as a Strong Buy. A Zacks Investment Research rank of 4, which recommends a Sell affirms that they expect a large upside in the stock from the current levels. A total of 5 brokerage firms believe that the stock is fairly valued, hence they advise a Hold on the stock.
KLA-Tencor Corporation (KLAC) : 5 investment research analysts covering KLA-Tencor Corporation (KLAC) have an average price target of $71.8 for the near short term. The highest target price given by the Brokerage Firm to the stock is $79 and the lowest target is $59 for the short term. Analysts expect the variance to be within $9.2 of the average price.
Company shares have received an average consensus rating of Hold for the current week
KLA-Tencor Corporation (NASDAQ:KLAC): During Wednesdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $75.60 and $75.56 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $76.10. The buying momentum continued till the end and the stock did not give up its gains. It closed at $76.09, notching a gain of 0.49% for the day. The total traded volume was 1,000,344 . The stock had closed at $75.72 on the previous day.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.