KLA-Tencor Corporation (NASDAQ:KLAC) : Zacks Investment Research ranks KLA-Tencor Corporation (NASDAQ:KLAC) as 2, which is a Buy recommendation. 2 research analysts consider that the stocks fundamentals point to a bright future, hence they rate the stock as a Strong Buy. A total of 5 analysts believe that the stock has a limited upside, hence they advise a Hold. The average broker rating of 7 research analysts is 2.43, which indicates as a Buy.
KLA-Tencor Corporation (NASDAQ:KLAC) stock is expected to deviate a maximum of $5.59 from the average target price of $67.6 for the short term period. 5 Street Experts have initiated coverage on the stock with the most promising target being $72 and the most muted being $59.
Company shares have received an average consensus rating of Hold for the current week
KLA-Tencor Corporation (NASDAQ:KLAC): stock turned positive on Tuesday. Though the stock opened at $71.61, the bulls momentum made the stock top out at $72.2 level for the day. The stock recorded a low of $71.55 and closed the trading day at $71.99, in the green by 1.01%. The total traded volume for the day was 2,163,501. The stock had closed at $71.27 in the previous days trading.
In an insider trading activity,The officer (Executive Vice President) of Kla Tencor Corp, Bell Bobby R sold 6,343 shares at $69.18 on May 4, 2016. The Insider selling transaction had a total value worth of $438,809. The Insider information was disclosed with the Securities and Exchange Commission in a Form 4 filing.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.