Analyst Rating Update on Tessera Technologies (TSRA)

Tessera Technologies (TSRA) : Zacks Investment Research ranks Tessera Technologies (TSRA) as 3, which is a Hold recommendation. 2 research analysts consider that the stocks fundamentals point to a bright future, hence they rate the stock as a Strong Buy. The average broker rating of 2 research analysts is 1, which indicates as a Strong Buy.

Tessera Technologies (TSRA) has been rated by 2 research analysts. Fundamentally, the highest shorterm price forecast for the stock is expected to reach $53 and the lowest price target forecast is $45. The average forecast of all the analysts is $49 and the expected standard deviation is $5.66.

For the current week, the company shares have a recommendation consensus of Buy.


Tessera Technologies (NASDAQ:TSRA): The stock opened at $30.10 on Wednesday but the bulls could not build on the opening and the stock topped out at $31.09 for the day. The stock traded down to $28.91 during the day, due to lack of any buying support eventually closed down at $31.02 with a loss of -3.27% for the day. The stock had closed at $32.07 on the previous day. The total traded volume was 1,181,992 shares.

Tessera Technologies, Inc. is a holding company. The Company operates its business through its subsidiaries, which include Invensas Corporation (Invensas), which is engaged in semiconductor interconnect innovation and intellectual property licensing, and FotoNation Limited (FotoNation), which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and imaging, including its LifeFocus, FaceTools, FacePower, FotoSavvy, DigitalAperture, face beautification, red-eye removal, high dynamic range, autofocus, panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.

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