Cabot Microelectronics Corporation (NASDAQ:CCMP) had declared a cash dividend of $0.1800 on Jun 6, 2016. The shares will quote ex-dividend on Jun 21, 2016 and the record date has been fixed on Jun 23, 2016. At Jun 6, 2016 share price, the yield comes out to be 1.6686%. The dividend payable date has been fixed on Jul 29, 2016.
Cabot Microelectronics Corporation (CCMP) shares turned negative on Fridays trading session with the shares closing down -0.32 points or -0.73% at a volume of 1,73,126. The pessimistic mood was evident in the company shares which never went considerably beyond the level of $43.85. The peak price level was also seen at $43.85 while the days lowest was $43.07. Finally the shares closed at $43.4. The 52-week high of the shares is $49.24 while the 52-week low is $34.53. According to the latest information available, the market cap of the company is $1,044 M.
Cabot Microelectronics Corporation(CCMP) last announced its earnings results on Apr 28, 2016 for Fiscal Year 2016 and Q2.Company reported revenue of $99.24M. Analysts had an estimated revenue of $103.00M. Earnings per share were $0.41. Analysts had estimated an EPS of $0.49.
Several Insider Transactions has been reported to the SEC. On Feb 10, 2016, Edward J Mooney (director) sold 8,819 shares at $38.24 per share price.Also, On Dec 2, 2015, William S Johnson (Executive Vice President, CFO) sold 20,672 shares at $41.98 per share price.On Nov 9, 2015, William P Noglows (Chairman, President & CEO) sold 67,086 shares at $43.06 per share price, according to the Form-4 filing with the securities and exchange commission.
Cabot Microelectronics Corporation is a supplier of polishing slurries and a growing polishing pad supplier used in the manufacture of advanced integrated circuit (IC) devices within the semiconductor industry in a process called chemical mechanical planarization (CMP). The Company is into the development manufacture and sale of CMP consumables products. It also develops produces and sells CMP slurries for polishing many of the conducting insulating and isolating materials used in IC devices and also for polishing the disk substrates and magnetic heads used in hard disk drives. The Company also develops manufactures and sells CMP polishing pads which are used in conjunction with slurries in the CMP process.