Deutsche Bank Maintains Lam Research Corporation to Buy with Price Target $105.00

Brokerage firm Deutsche Bank Maintains its rating on Lam Research Corporation(NASDAQ:LRCX). In a research note issued to the investors, the brokerage major Raises the price-target to $105.00 per share. The shares have been rated Buy. The rating by Deutsche Bank was issued on Jul 28, 2016.

Lam Research Corporation (LRCX) made into the market gainers list on Thursdays trading session with the shares advancing 1.26% or 1.14 points. Due to strong positive momentum, the stock ended at $91.93, which is also near the day’s high of $92. The stock began the session at $90.83 and the volume stood at 21,35,884 shares. The 52-week high of the shares is $93.8 and the 52 week low is $61.2. The company has a current market capitalization of $14,672 M and it has 15,95,97,650 shares in outstanding.

Lam Research Corporation(LRCX) last announced its earnings results on Jul 27, 2016 for Fiscal Year 2016 and Q4.Company reported revenue of $1.55B. Analysts had an estimated revenue of $1.53B. Earnings per share were $1.80. Analysts had estimated an EPS of $1.65.

Several Insider Transactions has been reported to the SEC. On Oct 27, 2015, Martin B Anstice (President and CEO) sold 7,948 shares at $73.90 per share price.Also, On Jul 28, 2015, Douglas R Bettinger (EVP, Chief Financial Officer) sold 10,043 shares at $82.29 per share price.On Apr 3, 2015, Sarah A O’dowd (SVP, Chief Legal Officer) sold 5,000 shares at $70.59 per share price, according to the Form-4 filing with the securities and exchange commission.

Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Company’s products are used primarily in front-end wafer processing which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a device’s sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles residues and film from the wafer surface before or after adjacent processes.

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