KLA-Tencor Corporation (KLAC) : 2 brokerage houses believe that KLA-Tencor Corporation (KLAC) is a Strong Buy at current levels. 5 analysts believe that the current prices are in a balance with the stocks fundamentals, hence they propose Hold on KLA-Tencor Corporation (KLAC). Zacks Investment Research suggests a Hold with a rank of 3.The median of all the 7 Wall Street Analysts endorse the stock as a Buy with a rating of 2.43.
KLA-Tencor Corporation (KLAC) : 5 Wall Street analysts covering KLA-Tencor Corporation (KLAC) believe that the average level the stock could reach for the short term is $67.6. The maximum price target given is $72 and the minimum target for short term is around $59, hence the standard deviation is calculated at $5.59.
KLA-Tencor Corporation (NASDAQ:KLAC): During Wednesdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $71.96 and $71.51 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $72.34. The buying momentum continued till the end and the stock did not give up its gains. It closed at $72.26, notching a gain of 0.21% for the day. The total traded volume was 1,895,486 . The stock had closed at $72.11 on the previous day.
The company shares have rallied 31.59% from its 1 Year high price. On Jun 23, 2016, the shares registered one year high at $75.17 and the one year low was seen on Aug 24, 2015. The 50-Day Moving Average price is $72.19 and the 200 Day Moving Average price is recorded at $69.56.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.