KLA-Tencor Corporation (KLAC) : During the past 4 weeks, traders have been relatively bearish on KLA-Tencor Corporation (KLAC), hence the stock is down -10.63% when compared to the S&P 500 during the same period. However, in the past 1 week, the selling of the stock is down by -4.21% relative to the S&P 500. The 4-week change in the price of the stock is -10.82% and the stock has fallen -4.83% in the past 1 week.
Company shares have received an average consensus rating of Hold for the current week The stock has recorded a twenty day Moving Average of 5.9% and the fifty day Moving Average is 7.48%. KLA-Tencor Corporation has dropped 6.8% during the last three month period . Year-to-Date the stock performance stands at -0.36%.
KLA-Tencor Corporation (KLAC) : Average target price received by KLA-Tencor Corporation (KLAC) is $71.8 with an expected standard deviation of $9.2. The most aggressive target on the stock is $79, whereas the most downbeat target is $59. 5 financial analysts are currently covering the stock.
KLA-Tencor Corporation (NASDAQ:KLAC): stock turned positive on Friday. Though the stock opened at $67.28, the bulls momentum made the stock top out at $67.64 level for the day. The stock recorded a low of $66.89 and closed the trading day at $67.52, in the green by 0.33%. The total traded volume for the day was 1,401,487. The stock had closed at $67.3 in the previous days trading.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.