KLA-Tencor Corporation (KLAC) has been under a strong bear grip, hence the stock is down -0.16% when compared to the S&P 500 in the past 4 weeks. However, in the near-term, buying emerged at lower levels and the stock has outperformed the S&P 500 by 0.4% in the past 1 week. The stock has risen by 0.56% in the past week indicating that the buyers are active at lower levels, but the stock is down -0.7% in the past 4 weeks.
The stock has recorded a 20-day Moving Average of 0.15% and the 50-Day Moving Average is 2.14%.The 200 Day SMA reached 0.33%
KLA-Tencor Corporation (NASDAQ:KLAC): After opening at $68.9, the stock dipped to an intraday low of $68.63 on Friday. However, the bulls stepped in to buy at lower levels and pushed the stock higher. The stock touched an intraday high of $69.86 and the buying power remained strong till the end. The stock closed at $69.71 for the day, a gain of 1.37% for the day session. The total traded volume was 1,466,204. The stocks close on the previous trading day was $69.71.
KLA-Tencor Corporation (KLAC) : 6 Wall Street analysts covering KLA-Tencor Corporation (KLAC) believe that the average level the stock could reach for the short term is $71. The maximum price target given is $80 and the minimum target for short term is around $59, hence the standard deviation is calculated at $8.76.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.