Lam Research Corporation (NASDAQ:LRCX) jumped 0.14 points or 0.17% on strong buying and was last priced at $82.81 per share. The shares saw huge fund flow intraday; a massive $18.12 million made their way in through the upticks but an even bigger $27.06 million made their way out through downticks. As per the last observation, the net money flow stood at $(-8.95) million and the up/down ratio was found to be 0.67. The shares have seen a weekly value change of 0.53% .A block trade was recorded in the company shares with a net money flow of $(-10.5) million. The composite value of the funds in upticks was $1.8 million and the total value of funds in downticks was $12.29. As can be seen from the data, the block transaction had the up/down ratio of 0.15.
Shares of Lam Research Corporation rose by 0.63% in the last five trading days and 12.46% for the last 4 weeks. Lam Research Corporation is up 4.75% in the last 3-month period. Year-to-Date the stock performance stands at 5.17%.
Currently the company Insiders own 0.43% of Lam Research Corporation shares according to the proxy statements. Institutional Investors own 98.98% of Lam Research Corporation shares. . On the companys insider trading activities, According to the information disclosed by the Securities and Exchange Commission in a Form 4 filing, the officer (President and CEO) of Lam Research Corp, Anstice Martin B had sold 7,948 shares worth of $587,357 in a transaction dated October 26, 2015. In this transaction, 7,948 shares were sold at $73.9 per share.
Lam Research Corporation (NASDAQ:LRCX) rose 0.27% or 0.22 points on Friday and made its way into the gainers of the day. After trading began at $82.51 the stock was seen hitting $82.9 as a peak level and $81.74 as the lowest level. The stock ended up at $82.89. The daily volume was measured at 2,362,474 shares. The 52-week high of the share price is $84.39 and the 52-week low is $61.2. The company has a market cap of $13,229 million.
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Companys products are used primarily in front-end wafer processing, which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition, its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability, such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a devices sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch, a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes.