KLA-Tencor Corp(NASDAQ:KLAC) announced the earnings results for Fiscal Year 2016 and Q4. The results came in during After-hours on Jul 28, 2016. Company reported revenue of $919.17M. Analysts estimated a revenue of $842.10M. Earnings per share were $1.77. Analysts had estimated an EPS of $1.42.
KLA-Tencor Corp (KLAC) made into the market gainers list on Thursdays trading session with the shares advancing 0.93% or 0.71 points. Due to strong positive momentum, the stock ended at $76.8, which is also near the day’s high of $76.81. The stock began the session at $75.95 and the volume stood at 4,01,520 shares. The 52-week high of the shares is $77.85 and the 52 week low is $44.95. The company has a current market capitalization of $11,958 M and it has 15,57,08,390 shares in outstanding.
Several Insider Transactions has been reported to the SEC. On Jul 7, 2016, Bren D. Higgins (EVP & Chief Financial Officer) sold 363 shares at $72.23 per share price.Also, On May 6, 2016, Bobby R Bell (Executive Vice President) sold 6,343 shares at $69.18 per share price.On Feb 10, 2016, Brian M. Trafas (SVP, Global Customer Org.) sold 3,057 shares at $64.60 per share price, according to the Form-4 filing with the securities and exchange commission.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Company’s products are also used in various other industries including the light emitting diode (LED) and data storage industries as well as general materials research. KLA-Tencor’s products and services are used by bare wafer integrated circuit (IC) lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness surface topography and composition measurements; measurement of in-chamber process conditions wafer shape and stress metrology; computational lithography tools and overall yield and fab-wide data management and analysis systems.