Revenue Update on Kulicke and Soffa Industries(NASDAQ:KLIC)

Kulicke and Soffa Industries(NASDAQ:KLIC) announced the earnings results for Fiscal Year 2016 and Q3. The results came in during Pre-market on Aug 3, 2016. Company reported revenue of $216.41M. Analysts estimated a revenue of $200.76M. Earnings per share were $0.45. Analysts had estimated an EPS of $0.37.

Kulicke and Soffa Industries (KLIC) made into the market gainers list on Fridays trading session with the shares advancing 0.55% or 0.07 points. Due to strong positive momentum, the stock ended at $12.82, which is also near the day’s high of $12.83. The stock began the session at $12.75 and the volume stood at 3,05,078 shares. The 52-week high of the shares is $12.975 and the 52 week low is $8.8. The company has a current market capitalization of $903 M and it has 7,04,01,751 shares in outstanding.

Several Insider Transactions has been reported to the SEC. On Jul 5, 2016, Brian R Bachman (director) sold 845 shares at $12.00 per share price.Also, On Feb 5, 2016, Jonathan Chou (Interim CEO, CFO) sold 4,900 shares at $12.00 per share price.On Dec 8, 2015, Peter T M Kong (director) sold 7,453 shares at $11.83 per share price, according to the Form-4 filing with the securities and exchange commission.

Kulicke and Soffa Industries Inc. (K&S) designs manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices including integrated circuits (IC) high and low powered discrete devices light-emitting diodes (LEDs) and power modules. The Company also service maintain repair and upgrade its equipment. Its customers consist of semiconductor device manufacturers outsourced semiconductor assembly and test providers (OSATs) other electronics manufacturers and automotive electronics suppliers. The Company operates in two business segments: Equipment and Expendable Tools. The Company’s Equipment segment manufactures and sells a line of ball bonders heavy wire wedge bonders and wafer level bonders. Expendable Tools segment manufactures and sells a variety of expendable tools for a range of semiconductor packaging applications. Its Expendable Tools segment products include: capillaries bonding wedges and dicing blades.

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