KLA-Tencor Corporation (KLAC) : The total money flow in KLA-Tencor Corporation (KLAC) was negative ($2.1 million), which signals selling by the traders on Thursdays session. They trimmed their holdings by selling the stock on downticks to the tune of $13.33 million. In comparison, the inflow of money into the stock on upticks was $11.23 million. The uptick to downtick ratio was 0.84. Similarly, the block trades show selling by large traders on strength. The value of stocks sold down on downtick was $0 million. The negative money flow of ($0 million) confirms the selling in KLA-Tencor Corporation (KLAC) on strength. KLA-Tencor Corporation (KLAC) gained $0.01 at $72.27, a gain of 0.01% over the previous days close. However, the stock registered -0.32% in the week.
KLA-Tencor Corporation (KLAC) : The highest level KLA-Tencor Corporation (KLAC) is projected to reach is $72 for the short term and the lowest estimate is at $59. The consolidated price target from 5 rating analysts who initiate coverage on the stock is $67.6 and the possibility the share price can swing is $5.59. The stock has recorded a 20-day Moving Average of 0.89% and the 50-Day Moving Average is 1.27%.
KLA-Tencor Corporation (NASDAQ:KLAC): The stock opened at $72.16 on Thursday but the bulls could not build on the opening and the stock topped out at $72.90 for the day. The stock traded down to $72.08 during the day, due to lack of any buying support eventually closed down at $72.24 with a loss of -0.03% for the day. The stock had closed at $72.26 on the previous day. The total traded volume was 1,893,686 shares.
KLA-Tencor Corporation is a supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. The Companys products are also used in various other industries, including the light emitting diode (LED) and data storage industries, as well as general materials research. KLA-Tencors products and services are used by bare wafer, integrated circuit (IC), lithography reticle and disk manufacturers around the world. These customers turn to the Company for inline wafer and IC defect monitoring, review and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension (CD) metrology; pattern overlay metrology; film thickness, surface topography and composition measurements; measurement of in-chamber process conditions, wafer shape and stress metrology; computational lithography tools, and overall yield and fab-wide data management and analysis systems.