Tessera Technologies (TSRA) : 2 Wall Street analysts covering Tessera Technologies (TSRA) believe that the average level the stock could reach for the short term is $48.5. The maximum price target given is $53 and the minimum target for short term is around $44, hence the standard deviation is calculated at $6.36.
Tessera Technologies (TSRA) : Zacks Investment Research ranks Tessera Technologies (TSRA) as 4, which is a Sell recommendation. 2 research analysts consider that the stocks fundamentals point to a bright future, hence they rate the stock as a Strong Buy. The average broker rating of 2 research analysts is 1, which indicates as a Strong Buy.
Tessera Technologies (NASDAQ:TSRA): During Thursdays trading session, Bulls were in full control of the stock right from the opening. The stock opened at $33.53 and $32.39 proved to be the low of the day. Continuous buying at higher levels pushed the stock towards an intraday high of $33.83. The buying momentum continued till the end and the stock did not give up its gains. It closed at $33.71, notching a gain of 0.51% for the day. The total traded volume was 268,739 . The stock had closed at $33.54 on the previous day.
Tessera Technologies, Inc. is a holding company. The Company operates its business through its subsidiaries, which include Invensas Corporation (Invensas), which is engaged in semiconductor interconnect innovation and intellectual property licensing, and FotoNation Limited (FotoNation), which provides face-oriented imaging technologies. Its technologies include semiconductor packaging and interconnect solutions, and products and solutions for mobile and imaging, including its LifeFocus, FaceTools, FacePower, FotoSavvy, DigitalAperture, face beautification, red-eye removal, high dynamic range, autofocus, panorama and image stabilization intellectual property. Its packaging capabilities include a low-temperature wafer bonding technology platform that manages the delivery of 2.5-dimensional (2.5D) and three-dimensional integrated circuit (3D-IC) solutions. The Companys 2.5D and 3D-IC solutions include ZiBond direct bonding and DBI hybrid bonding technologies.