UBS Maintains Lam Research Corporation to Buy with Price Target $105.00

Brokerage firm UBS Maintains its rating on Lam Research Corporation(NASDAQ:LRCX). In a research note issued to the investors, the brokerage major Raises the price-target to $105.00 per share. The shares have been rated Buy. The rating by UBS was issued on Jul 28, 2016.

In a different note, On Jul 28, 2016, Deutsche Bank said it Maintains its rating on Lam Research Corporation. In the research note, the firm Raises the price-target to $95.00 per share. The shares have been rated ‘Buy’ by the firm.

Lam Research Corporation (LRCX) made into the market gainers list on Thursdays trading session with the shares advancing 1.26% or 1.14 points. Due to strong positive momentum, the stock ended at $91.93, which is also near the day’s high of $92. The stock began the session at $90.83 and the volume stood at 21,35,884 shares. The 52-week high of the shares is $93.8 and the 52 week low is $61.2. The company has a current market capitalization of $14,672 M and it has 15,95,97,650 shares in outstanding.

Lam Research Corporation(LRCX) last announced its earnings results on Jul 27, 2016 for Fiscal Year 2016 and Q4.Company reported revenue of $1.55B. Analysts had an estimated revenue of $1.53B. Earnings per share were $1.80. Analysts had estimated an EPS of $1.65.

Several Insider Transactions has been reported to the SEC. On Oct 27, 2015, Martin B Anstice (President and CEO) sold 7,948 shares at $73.90 per share price.Also, On Jul 28, 2015, Douglas R Bettinger (EVP, Chief Financial Officer) sold 10,043 shares at $82.29 per share price.On Apr 3, 2015, Sarah A O’dowd (SVP, Chief Legal Officer) sold 5,000 shares at $70.59 per share price, according to the Form-4 filing with the securities and exchange commission.

Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Company’s products are used primarily in front-end wafer processing which involves the steps that create the active components of a device and their wiring. It also addresses processes for back-end wafer-level packaging (WLP). In addition its products are offered for related markets that rely on semiconductor processes and require production-proven manufacturing capability such as micro-electromechanical systems (MEMS). Its thin film deposition systems form a device’s sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. It is a provider of plasma etch a process step that selectively removes materials from the wafer to create the features and patterns of a device. Its wet spin clean and plasma-based bevel clean products remove particles residues and film from the wafer surface before or after adjacent processes.

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